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Reusable ESD-Safe Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor IC Protection

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Reusable ESD-Safe Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor IC Protection

Payment Terms : T/T

Color : Black

Cavity Size : 12.12X2.04X0.86 mm

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Packing Level : Transport package

Warpage : Warpage MAX 0.22mm

Model Number : HN25026

Mold Type : Injection

Capacity : 3X13=39 PCS

Outline Line Size : 50.8x50.8x3.94 mm

Ic Type : BGA,QFP,QFN,LGA,PGA

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Tray Shape : Rectangular

Certification : ROHS, ISO

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Brand Name : Hiner-pack

Reusable : Yes

Packaging Details : CARTON, PALLET

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Waffle Pack Chip Trays for Semiconductor IC Testing Handling and Storage Protection

Separate individual IC chips inside special slot structures. Prevent mutual friction and collision during frequent operational movements. Maintain stable performance under long‑term cyclic usage within semiconductor production lines.


Isolate chips from external contact to cut surface‑damage risks. Fit continuous test workflows without extra adjustment work. Hold components steady across testing, sorting and warehouse storage cycles.


Support neat stacking to make full use of available factory space. Keep original slot shape under regular stacking pressure. Meet high‑standard storage and handling demands for precision semiconductor components.

Key Features/ Benefits
  • Stable conductive ESD performance
  • Guard chips against surface damage
  • Adapt to testing & long‑time storage
  • Support custom specifications
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25026
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8x50.8x3.94 mm
Cavity Size 12.12X2.04X0.86 mm
Matrix QTY 3X13=39 PCS
Warpage MAX 0.22 mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Handle semiconductor IC testing, component sorting and short‑term stock keeping work. Isolate precision chips while carrying out inspection and in‑plant circulation. Lower scrap rate caused by chip‑to‑chip rubbing and impact.


Work within semiconductor test workshops and component inventory areas. Offer reliable holding solution for diverse IC parts in mass‑batch production cycles.

Customized Services
Customize slot dimensions, cavity layouts and outer overall sizes to match various IC chip outlines. Modify material hardness and anti‑static performance to satisfy unique production conditions. Deliver pre‑production samples for performance verification. Accept bulk‑order customization to satisfy diversified semiconductor component storage and handling requirements.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Product Tags:

Waffle Pack Chip Trays for semiconductor IC testing

      

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Quality Reusable ESD-Safe Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor IC Protection for sale

Reusable ESD-Safe Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor IC Protection Images

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